This paper presents the results of an experimental study of the effects of surface
texture on the optical and light trapping properties of silicon wafers. Surface
texture is controlled by anisotropic etching with potassium hydroxide (KOH) and
isopropyl alcohol (IPA) solutions. The anisotropic etching of (001) crystalline
silicon wafers is shown to result in the formation of {111} pyramidal facets on the
surfaces of the wafers. A combination of profilometry, optical microscopy,
scanning electron microscopy, and atomic force microscopy is used to study the
effects of KOH/IPA etching on the morphology and roughness of the textured
surfaces. The results show that IPA concentration has the strongest effect on the
surface roughness of (001)-single crystal crystals at temperatures up to 80 C.
Above this value, evidence of temperature-induced cracking was revealed on the
silicon substrate. The best volume concentration ratio of KOH:IPA is also found to
be 2:4. The implications of the study are discussed for the design of light trapping
in silicon solar cells. VC 2015 AIP Publishing LLC.